{"id":57372,"date":"2026-03-30T09:57:05","date_gmt":"2026-03-30T07:57:05","guid":{"rendered":"https:\/\/www.nae.fr\/2026\/03\/30\/epc-releases-egan-phase-18-reliability-report\/"},"modified":"2026-03-30T09:57:05","modified_gmt":"2026-03-30T07:57:05","slug":"epc-releases-egan-phase-18-reliability-report","status":"publish","type":"post","link":"https:\/\/www.nae.fr\/en\/2026\/03\/30\/epc-releases-egan-phase-18-reliability-report\/","title":{"rendered":"EPC releases eGaN Phase 18 reliability report"},"content":{"rendered":"
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\n\nThe report builds on previous work by closing the gap between lab-generated reliability testing and real-world device performance across mission profiles. It introduces new methodologies to better predict device lifetime under application-specific stress conditions, shaped through close collaboration with customers and supported by peer-reviewed research and international conference publications.\n\nThe report emphasises the significance of comprehending the fundamental wear-out mechanisms in GaN HEMTs and presents a quantitative methodology for estimating the overall device lifetime based on the predominant stress conditions experienced during operation. The methodology allows for more accurate lifetime predictions across a wide range of applications by combining different stress factors, like voltage, current, temperature, and duty cycles.\n\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div><\/blockquote>\n
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\n\nPour en savoir plus : EPC releases eGaN Phase 18 reliability report<\/a>\n\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>","protected":false},"excerpt":{"rendered":"

The report builds on previous work by closing the gap between lab-generated reliability testing and real-world device performance across mission profiles. It introduces new methodologies to better predict device lifetime under application-specific stress conditions, shaped through close collaboration with customers and supported by peer-reviewed research and international conference publications. The report emphasises the significance of […]<\/p>\n","protected":false},"author":1,"featured_media":57373,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[34,16],"tags":[35,45,30],"class_list":["post-57372","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-innovation-et-technologique","category-rti","tag-actualites","tag-electrification-et-fiabilite-des-systemes-embarques","tag-fiabilite-des-systemes-et-des-composants"],"acf":[],"yoast_head":"\nEPC releases eGaN Phase 18 reliability report - NAE<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.nae.fr\/en\/2026\/03\/30\/epc-releases-egan-phase-18-reliability-report\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"EPC releases eGaN Phase 18 reliability report - NAE\" \/>\n<meta property=\"og:description\" content=\"The report builds on previous work by closing the gap between lab-generated reliability testing and real-world device performance across mission profiles. It introduces new methodologies to better predict device lifetime under application-specific stress conditions, shaped through close collaboration with customers and supported by peer-reviewed research and international conference publications. 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