{"id":57442,"date":"2026-04-07T09:55:20","date_gmt":"2026-04-07T07:55:20","guid":{"rendered":"https:\/\/www.nae.fr\/2026\/04\/07\/analysis-of-electronic-and-semiconductor-modules-using-lock-in-thermography\/"},"modified":"2026-04-07T09:55:20","modified_gmt":"2026-04-07T07:55:20","slug":"analysis-of-electronic-and-semiconductor-modules-using-lock-in-thermography","status":"publish","type":"post","link":"https:\/\/www.nae.fr\/en\/2026\/04\/07\/analysis-of-electronic-and-semiconductor-modules-using-lock-in-thermography\/","title":{"rendered":"Analysis of Electronic and Semiconductor Modules Using Lock-in Thermography"},"content":{"rendered":"
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\n\nInfraTec<\/a>\u00a0has developed the\u00a0E-LIT<\/a>\u00a0automation \u00a0solution specifically for the inspection of electronic and semiconductor modules. Designed as a modular test system, E-LIT uses lock-in thermography to identify and localize thermal anomalies reliably, even in multilayer PCBs and multi-chip modules.\n

Precise Temperature Measurement and Fault Detection<\/h2>\n

Depending on the spatial resolution of the infrared camera, several hundred thousand to several million pixels can be recorded. The temperature at the surface of the test object is then calculated from the intensity of the detected radiation, with each pixel in the resulting thermal image assigned a discrete temperature value corresponding to a specific area of the object.<\/p>\n\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div><\/blockquote>\n

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\n\nPour en savoir plus : Analysis of Electronic and Semiconductor Modules Using Lock-in Thermography<\/a>\n\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>","protected":false},"excerpt":{"rendered":"

InfraTec\u00a0has developed the\u00a0E-LIT\u00a0automation \u00a0solution specifically for the inspection of electronic and semiconductor modules. Designed as a modular test system, E-LIT uses lock-in thermography to identify and localize thermal anomalies reliably, even in multilayer PCBs and multi-chip modules. Precise Temperature Measurement and Fault Detection Depending on the spatial resolution of the infrared camera, several hundred thousand […]<\/p>\n","protected":false},"author":1,"featured_media":57443,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[34,16],"tags":[35,45,30],"class_list":["post-57442","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-innovation-et-technologique","category-rti","tag-actualites","tag-electrification-et-fiabilite-des-systemes-embarques","tag-fiabilite-des-systemes-et-des-composants"],"acf":[],"yoast_head":"\nAnalysis of Electronic and Semiconductor Modules Using Lock-in Thermography - NAE<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.nae.fr\/en\/2026\/04\/07\/analysis-of-electronic-and-semiconductor-modules-using-lock-in-thermography\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Analysis of Electronic and Semiconductor Modules Using Lock-in Thermography - NAE\" \/>\n<meta property=\"og:description\" content=\"InfraTec\u00a0has developed the\u00a0E-LIT\u00a0automation \u00a0solution specifically for the inspection of electronic and semiconductor modules. Designed as a modular test system, E-LIT uses lock-in thermography to identify and localize thermal anomalies reliably, even in multilayer PCBs and multi-chip modules. Precise Temperature Measurement and Fault Detection Depending on the spatial resolution of the infrared camera, several hundred thousand […]\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.nae.fr\/en\/2026\/04\/07\/analysis-of-electronic-and-semiconductor-modules-using-lock-in-thermography\/\" \/>\n<meta property=\"og:site_name\" content=\"NAE\" \/>\n<meta property=\"article:published_time\" content=\"2026-04-07T07:55:20+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.nae.fr\/wp-content\/uploads\/2026\/06\/InfraTec-Thermography-E-LIT__1838.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1838\" \/>\n\t<meta property=\"og:image:height\" content=\"1150\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"adminwa\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"adminwa\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.nae.fr\\\/2026\\\/04\\\/07\\\/analysis-of-electronic-and-semiconductor-modules-using-lock-in-thermography\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.nae.fr\\\/2026\\\/04\\\/07\\\/analysis-of-electronic-and-semiconductor-modules-using-lock-in-thermography\\\/\"},\"author\":{\"name\":\"adminwa\",\"@id\":\"https:\\\/\\\/www.nae.fr\\\/#\\\/schema\\\/person\\\/3d658e930f01449b7195ce4a78fcfc1e\"},\"headline\":\"Analysis of Electronic and Semiconductor Modules Using Lock-in Thermography\",\"datePublished\":\"2026-04-07T07:55:20+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.nae.fr\\\/2026\\\/04\\\/07\\\/analysis-of-electronic-and-semiconductor-modules-using-lock-in-thermography\\\/\"},\"wordCount\":127,\"commentCount\":0,\"publisher\":{\"@id\":\"https:\\\/\\\/www.nae.fr\\\/#organization\"},\"image\":{\"@id\":\"https:\\\/\\\/www.nae.fr\\\/2026\\\/04\\\/07\\\/analysis-of-electronic-and-semiconductor-modules-using-lock-in-thermography\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.nae.fr\\\/wp-content\\\/uploads\\\/2026\\\/06\\\/InfraTec-Thermography-E-LIT__1838.jpg\",\"keywords\":[\"Actualit\u00e9s\",\"Electrification et fiabilit\u00e9 des syst\u00e8mes embarqu\u00e9s\",\"Fiabilit\u00e9 des syst\u00e8mes et des composants\"],\"articleSection\":[\"Innovation et technologique\",\"RTI\"],\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\\\/\\\/www.nae.fr\\\/2026\\\/04\\\/07\\\/analysis-of-electronic-and-semiconductor-modules-using-lock-in-thermography\\\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.nae.fr\\\/2026\\\/04\\\/07\\\/analysis-of-electronic-and-semiconductor-modules-using-lock-in-thermography\\\/\",\"url\":\"https:\\\/\\\/www.nae.fr\\\/2026\\\/04\\\/07\\\/analysis-of-electronic-and-semiconductor-modules-using-lock-in-thermography\\\/\",\"name\":\"Analysis of Electronic and Semiconductor Modules Using Lock-in Thermography - 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