Electronic packaging materials that exhibit favorable electromagnetic wave absorption (EMA) and thermal conductive features are critically important for the protection of growing high-power advanced electronics. However, existing bifunctional materials emphasize only single EMA performance and suffer from severely insufficient thermal conductivity. Thus, it remains an enormous challenge to develop a highly thermally conductive electromagnetic absorber. Herein, inspired by nacre shell, we propose phonon bridges embedding a layered skeleton-densification strategy to prepare biaxially oriented SiC@BN/WPU composite for integrating efficient phonon transport with strong electromagnetic absorption.
