Efficient heat dissipation across GaN/SiC interfaces is critical for the reliability of high-power devices, yet their interfacial thermal transport behavior remains insufficiently understood. Here, using a high-fidelity machine-learning interatomic potential, we...

Researchers at Sandia National Laboratories and Auburn University in the US have developed a new method to more accurately detect atomic-scale defects in electronic materials, an advance that could be particularly useful for wide-bandgap (WBG) semiconductors such as...

We propose a new numerical method to estimate the fault tolerance of failure modes in digital circuit structures with a generative network sampling technique. From a random input of generated bitwise configurations of ideally digitalised analog currents in the digital...

Toshiba Electronics Europe has started shipping engineering samples of the TB9M040FTG, a chip that combines a 32-bit microcontroller (MCU) with built-in power MOSFETs for driving small automotive brushless DC (BLDC) motors of under 40W. The device joins Toshiba’s...