Efficient heat dissipation across GaN/SiC interfaces is critical for the reliability of high-power devices, yet their interfacial thermal transport behavior remains insufficiently understood. Here, using a high-fidelity machine-learning interatomic potential,...

Researchers at Sandia National Laboratories and Auburn University in the US have developed a new method to more accurately detect atomic-scale defects in electronic materials, an advance that could be...

We propose a new numerical method to estimate the fault tolerance of failure modes in digital circuit structures with a generative network sampling technique. From a random input of generated...

Toshiba Electronics Europe has started shipping engineering samples of the TB9M040FTG, a chip that combines a 32-bit microcontroller (MCU) with built-in power MOSFETs for driving small automotive brushless DC (BLDC)...

A German SME specializes in advanced joining and assembly technologies for high-performance electrical and optical components. Its core expertise lies in flux-free soldering, enabling thermally stable, low-resistance and highly reliable...