As 5G networks and artificial intelligence (AI) technologies continue to evolve, the demand for high-performance computing (HPC) has surged.
These advancements have led to increasingly dense transistor networks in AI data centers and 5G infrastructure, resulting in significant heat generation. To maintain system reliability and efficiency, thermal interface materials (TIMs) play a critical role in managing heat dissipation and ensuring optimal performance.
The Role of Thermal Interface Materials in 5G and AI Data Centers: Managing Heat in High-Performance Computing
