Reinventing Thermal Management: Advanced Materials for High-Power Electronics and EVs

As electronic devices and EV systems continue to push the boundaries of power density and miniaturization, managing heat has become one of the most pressing engineering challenges.

In high-power applications like silicon carbide (SiC) and gallium nitride (GaN) devices, or in EV battery modules, thermal inefficiencies can directly translate to reduced performance, shorter component lifetimes, and even safety risks.

For example, in EVs, every 10 °C rise in battery temperature can reduce cycle life by nearly 20 %. Similarly, in advanced chips, localized heat spikes can create thermal stress that leads to delamination or interconnect fatigue. These realities make materials-based thermal management essential to sustaining reliability and performance.