To address the critical challenges of heat accumulation and electromagnetic interference in high-power electronic packaging, which severely restrict the performance stability and service life of electronic devices. This study develops a multifunctional epoxy-based composite (MXene@MDCF/EP) through synergistically designed electrostatic self-assembly. By leveraging the opposite surface potentials of MXene (-39.5 mV) and melamine-derived carbon foam (MDCF, +23.4 mV), we constructed a 3D hierarchical network where MXene nanosheets are uniformly anchored onto MDCF scaffolds.