Efficient thermal management is critical for the reliability and performance of power electronics systems in automotive applications. This work presents a computationally efficient modeling approach for transient thermal simulation of power electronic systems, with a focus on inverter modules using multiple MOSFETs mounted on a printed circuit board assembly (PCBA). A case study of an inverter module comprising six MOSFETs arranged as high-side and low-side pairs for a three phases system mounted on a PCBA, attached to a heat sink is considered. Computational fluid dynamic (CFD) simulations in Ansys Icepak are performed considering different heat transfer mechanisms, including natural convection, forced convection at constant velocity, and forced convection with varying flow velocity.
Pour en savoir plus : A Scalable Approach for Transient Thermal Modeling of Automotive Power Electronics
