26 05 2026 | Innovation et technologique
Researchers at Sandia National Laboratories and Auburn University in the US have developed a new method to more accurately detect atomic-scale defects in electronic materials, an advance that could be particularly useful for wide-bandgap (WBG) semiconductors such as...
26 05 2026 | Innovation et technologique
We propose a new numerical method to estimate the fault tolerance of failure modes in digital circuit structures with a generative network sampling technique. From a random input of generated bitwise configurations of ideally digitalised analog currents in the digital...
26 05 2026 | Innovation et technologique
Toshiba Electronics Europe has started shipping engineering samples of the TB9M040FTG, a chip that combines a 32-bit microcontroller (MCU) with built-in power MOSFETs for driving small automotive brushless DC (BLDC) motors of under 40W. The device joins Toshiba’s...
26 05 2026 | Innovation et technologique
A German SME specializes in advanced joining and assembly technologies for high-performance electrical and optical components. Its core expertise lies in flux-free soldering, enabling thermally stable, low-resistance and highly reliable joints for demanding...
26 05 2026 | Innovation et technologique
Russia launched the largest aerial assault on Ukraine since the beginning of the war, targeting Kyiv and multiple regions with hundreds of drones and missiles over a two day period. According to Ukrainian officials, the attacks involved more than 1,500 drones and...
26 05 2026 | Innovation et technologique
En 2021, l’Administration suédoise du matériel de défense [Försvarets materielverk – FMV] attribua à Kockums [filiale de Saab] un contrat pour mener des études dans le cadre du programme «nouvelle génération de bâtiment de surface» [ou classe Luleå], lequel prévoyait...
