Ga-based liquid metals (GLMs) have been considered as promising thermal and electrical interface materials for advanced power electronics, combining high thermal conductivity (some types even >30 W/m·K) with fluidity at room temperature. This review systematically evaluates the dual roles of GLMs in power electronics packaging. Their function in thermal management as both thermal interface materials and active cooling media is first examined, followed by an analysis of their capabilities in forming electrical interconnections via low-temperature bonding in fluidic and solid states. However, reliable integration remains challenging due to interfacial reactions and instability with metal substrates.
Pour en savoir plus : Ga-Based Liquid Metals: Advances in Interface Thermal and Electrical Regulations for Power Electronics Integration
