The rapid advancement of electronic technology has enhanced the integration and performance of electronic devices, yet it has also posed significant thermal management challenges, especially for highpower GaN-based electronic devices. These devices exhibit a noticeable self-heating effect during operation due to Joule heat generation. Consequently, heat dissipation has emerged as a critical bottleneck hindering their advancement. This article provides a comprehensive review of thermal transfer methods and the self-heating effect for electronic devices. It introduces several advanced external thermal management technologies for electronic devices, such as heat pipe cooling, microchannel cooling, jet impact cooling, spray cooling, and thermoelectric cooling.
Pour en savoir plus : Research progress on self-heating effects and thermal management strategies of GaN-based electronic devices
