16 05 2022 | Innovation et technologie
STMicroelectronics is supplying silicon carbide (SiC) technology for eMPack electric-vehicle (EV) power modules from Semikron, a leading manufacturer of power modules and systems. This is the result of a four-year technical collaboration between the two companies to...
9 05 2022 | Actualités NAE - RTI
Chaque semaine NAE vous propose une veille technologique sur une thématique de sa feuille de route technologique. Aujourd’hui retrouvez sa veille sur la thématique Fiabilité électronique qui abordera : Investigation of reliability of NO nitrided SiC(1100) MOS devices...
9 05 2022 | Innovation et technologique, Actualité Défense et Sécurité
We systematically investigated the interface properties and reliability of NO nitrided SiC(11¯00) m-face MOS devices. Although nitridation at 1250°C improved the capacitance-voltage characteristics (i.e., flat-band voltage (V FB ) shift and hysteresis), the...
9 05 2022 | Actualité Défense et Sécurité, Innovation et technologie
This paper presents an analysis of power cycling (PC) capabilities of two industry-standard packages with silicon carbide power MOSFET dies: the discrete TO-247 package and a base-plate-less power module with silicone gel encapsulation. PC experiments show a more than...
2 05 2022 | Innovation et technologie
Navitas Semiconductor’s next-generation GaNFast power ICs with GaNSense technology has been chosen to power vivo’s newly released, first folding-screen flagship ‘X Fold’ in-box 80W flash charger. The vivo X Fold adopts a high-capacity 4,600mAhr...
