Thermoreversible adhesives allow for on-demand bonding and debonding on diverse surfaces through thermal stimulation. They have great potential in applications such as temporary fixation, which helps lower product costs and meet the requirements for environmental protection. However, the existing thermoreversible adhesive materials face challenges such as imprecise thermal switching, excessively high detachment temperatures, or poor bonding stability. To address these issues, here, we innovatively introduce temperature-responsive crystalline domains with an appropriate melting temperature (Tm) into the adhesive.