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Chaque semaine NAE vous propose une veille technologique sur une thématique de sa feuille de route technologique.

Aujourd’hui retrouvez sa veille sur la thématique Fiabilité électronique qui abordera :

  • Transphorm to make new type of gallium nitride epi wafers in the US
    Source : www.eenewspower.com – 2019-08-02
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  • Frequency- and Temperature-Dependent Gate Reliability of Schottky-Type p -GaN Gate HEMTs
    Source : www.scopus.com – 2019-08-01
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  • The Effect of Carrier Gas and Reactor Pressure on Gallium Nitride Growth in MOCVD Manufacturing Process
    Source : www.scopus.com – 2019-08-01
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  • Mechanical Reliability of Thick Films for High-Temperature Packaging
    Source : ieeexplore.ieee.org – 2019-07-22
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  • Thermal shock reliability of GaN die-attached on DBA with Ag sinter paste
    Source : ieeexplore.ieee.org – 2019-07-21
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  • Modelling Thermo-Mechanical Stress in GaN-LEDs Soldered on Copper Substrate with Simulations Validated by Raman Experiments
    Source : ieeexplore.ieee.org – 2019-07-21
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  • Simulative Comparison of Polymer and Ceramic Encapsulation on SiC-MOSFET Power Modules under Thermomechanical Load
    Source : ieeexplore.ieee.org – 2019-07-21
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  • Packaging Solution For GaN On Silicon Power Devices
    Source : powerelectronicsworld.net – 2019-07-09
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  • Functional Printing Market Advanced Technologies and Innovations 2015-2025 – Wiki Times
    Source : www.wikitimes.co.uk – 2019-07-08
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  • Système de commande de grille pour modules à double alimentation IGBT et SiC | Power Integrations
    Source : www.vipress.net – 2019-07-03
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  • Conductive Inks: Power Electronics, EMI Shielding, In-Mold Electronics
    Source : www.idtechex.com – 2019-07-03
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  • Antennas for Emerging 5G Systems
    Source : www.hindawi.com – 2019-07-01
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  • A new method for an old topic: Efficient and reliable estimation of material bulk modulus
    Source : www.scopus.com – 2019-07-01
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