BAE Systems has completed the first phase of a DARPA program focused on reducing heat in high-power radio frequency electronics and will continue the work under Phase 2.
The company’s FAST Labs research and development organization is working under DARPA’s Technologies for Heat Removal in Electronics at the Device Scale (THREADS) program, which seeks to address thermal constraints in RF transistors, particularly those made from gallium nitride (GaN).
“We look forward to advancing to Phase 2 of the THREADS program,” said Isaac Wildeson, principal investigator at BAE Systems’ FAST Labs.
Pour en savoir plus : BAE Clears Phase 1 of DARPA Effort to Cool Down High-Power RF Electronics
