This work describes the development of a single phase water-cooled microfluidic heat exchanger for cooling very high heat flux electronics. The heat sink was designed for a unique additive manufacturing process capable of manufacturing millimeter-scale metallic parts with micron-scale features. The design was undertaken using Simulation-Driven Design whereby the commercial Computational Fluid Dynamics software ANSYS Fluent was utilized. The final embodiment of the design is a water-cooled microchannel heat
An ultra high performance heat sink using a novel hybrid impinging microjet — Microchannel structure – IEEE Conference Publication
