Du 2 au 4 juin prochains, Lyon – France accueillera la prochaine édition du salon 3D PRINT, rendez-vous incontournable de la fabrication additive. Cette année, l’événement se distingue en mettant l’accent sur cinq secteurs stratégiques : automobile, aéronautique,...
Successfully develops SiC Planar MOSFET process platform for 450V–2300V, securing high reliability and yield competitiveness Accelerates SiC-based compound semiconductor foundry business by initiating 1200V SiC MOSFET development for a new customer SEOUL, South...
With DTEP funding, Filtronic has developed cutting-edge plastic packaging technology for high-power semiconductors, strengthening the UK’s independence in critical defence technology. Filtronic used DTEP funding to solve a longstanding engineering challenge —...
This study reports the optical and plasmonic properties of unconventional transition metal nanoparticles (UTM-NPs), which include Ti, Mo, Rh, Zn, Ta, Sc, Au, Ag and Re by analyzing their quality factor (Q-factor), dielectric constants and plasma frequency across a...
Cela fera deux ans, en avril, que la France et l’Allemagne ont relancé leur projet de Système principal de combat terrestre [MGCS – Main Ground Combat System] en signant l’accord d’arrangement de la phase 1A, lequel prévoit d’instaurer huit piliers technologiques...
This paper proposes a novel task for UAV scene understanding – UAV Scene Change Captioning (UAV-SCC) – which aims to generate natural language descriptions of semantic changes in dynamic aerial imagery captured from a movable viewpoint. Unlike traditional...
