13 04 2026 | Innovation et technologique, Actualité Aéronautique
The integration of “load bearing – deicing” is of great significance for safe use of carbon fiber composites in ice environment. Here, an investigation on the design, deicing performance and mechanical properties of super hybrid composites composed of stainless...
13 04 2026 | Actualité Aéronautique
Des freins portés à plus de 1 371 °C, des roues qui rougeoient, des bouchons fusibles qui fondent par conception : le Boeing 777-9 vient de franchir l’une des épreuves de certification les plus exigeantes de l’aéronautique civile. Un test spectaculaire, orchestré sur...
7 04 2026 | Innovation et technologique
Pour les onduleurs solaires, les centres de données IA et plus encore… Technologie GaN bidirectionnelle de première mondiale avec blocage DC intégré, réduisant drastiquement le nombre de commutateurs nécessaires dans les topologies de conversion de puissance...
7 04 2026 | Innovation et technologique
Taiwan Semiconductor has added to its growing series of AEC-Q-qualified 1200V-rated SiC Schottky diodes with 1A and 2A models. Applications benefiting from the reduced size and performance provided by these new, high-voltage, low-current, very fast, low-loss diodes...
7 04 2026 | Innovation et technologique
In semiconductor manufacturing, numerous key materials and components determine process stability and product yield. While not as widely recognized as wafers or targets, semiconductor graphite fixtures...
7 04 2026 | Innovation et technologique
InfraTec has developed the E-LIT automation solution specifically for the inspection of electronic and semiconductor modules. Designed as a modular test system, E-LIT uses lock-in thermography to identify and localize thermal anomalies reliably, even in multilayer...
