Infineon has expanded it its CoolGaN BDS 40 V G3 bidirectional switch (BDS) family with two new devices, the IGK048B041S and IGK120B041S. The new additions reduce PCB footprint by up to 82 percent and cut component count in half.
For engineers designing within the strict spatial constraints of modern smartphones, notebooks, and wearables, the new devices give greater flexibility to optimise efficiency and streamline designs without sacrificing performance, according to Infineon.
Pour en savoir plus : Infineon 40V CoolGaN BDS family shrinks portable power designs
