This hybrid technique not only improves the quality factor and frequency tunability of RF metastructures, but it also reduces device footprint by up to 45 percent.
Researchers developed a hybrid fabrication method combining 2PP, electroplating, and dry etching for microstructures.
The new process fabricates microstructures with sub-10-micron resolution and a 1:4 aspect ratio.
The 3D-printed resonators reduce device footprint by up to 45 percent while maintaining performance.
Pour en savoir plus : Marrying Nanoscale 3D Printing with Advanced Metal Processing
