Highlights
- • PCB embedding processes presented and technical challenges discussed
- • Review of requirements for embedding materials
- • List of 22 embedding demonstrators with key performance numbers
- • Discussion of reliability of embedded power packages
Abstract
Embedding power semiconductor devices into printed circuit boards (PCB) provides several benefits compared to conventional packaging technologies. Integrating the semiconductor dies into the circuit board reduces the converter size. This results in short current loops, enabling low interconnection resistances and parasitic inductances. Both contribute to a higher system-level efficiency, as conduction and switching losses are reduced. Moreover, the use of thick Cu substrates allows efficient heat removal, due to a low thermal resistance.
Pour en savoir plus : Printed Circuit Board Embedded Power Semiconductors: A Technology Review