Today’s 3-line summary
SEMIFIVE won a $52 million AI inference ASIC development contract from a US AI fabless company. The chip will use LPDDR6.
TDK and Taiyo Yuden will co-develop MLCCs and inductors for AI servers and explore cooperation extending to manufacturing and procurement.
Hamamatsu Photonics launched iPHEMOS-DDX, a failure analysis system for HBM and chiplet packages.
SEMIFIVE Wins $52M AI Inference ASIC Deal From US Fabless Firm, LPDDR6 Chip Targets 2028 Volume Production [Sep 30, 2026 Semiconductor News] My Take: Why a Fabless Company Hands Over Its Chip From the Spec
