Thermoreversible adhesives allow for on-demand bonding and debonding on diverse surfaces through thermal stimulation. They have great potential in applications such as temporary fixation, which helps lower product costs and meet the requirements for environmental...
Des chercheurs de l’Indian Institute of Science (IISc) ont découvert des principes fondamentaux pour la conception des transistors de puissance à base de nitrure de gallium (GaN), les rendant plus sûrs et plus faciles à utiliser dans l’électronique de haute valeur...
The use of Silicon Carbide (SiC) MOSFETs significantly improves converter performance by increasing efficiency and reducing costs, to the detriment of electro-magnetic emission and reliability. Implementing a predictive maintenance strategy based on a prognosis tool...
Infineon’s CoolSiC MOSFETs have been adopted in the new bZ4X model from Japanese car companyToyota. Integrated into the on-board charger (OBC) and DC/DC converter, the SiC MOSFETs leverage the material’s advantages of low losses, high thermal resistance,...
Navitas has announced the launch of its 5th-generation GeneSiC technology platform. The High Voltage (HV) SiC Trench-Assisted Planar (TAP) MOSFET technology is claimed to represent a significant technological leap over previous generations. The technology, which will...
