23 02 2026 | Innovation et technologique
Thermoreversible adhesives allow for on-demand bonding and debonding on diverse surfaces through thermal stimulation. They have great potential in applications such as temporary fixation, which helps lower product costs and meet the requirements for environmental...
23 02 2026 | Innovation et technologique
Des chercheurs de l’Indian Institute of Science (IISc) ont découvert des principes fondamentaux pour la conception des transistors de puissance à base de nitrure de gallium (GaN), les rendant plus sûrs et plus faciles à utiliser dans l’électronique de haute valeur...
23 02 2026 | Innovation et technologique
The use of Silicon Carbide (SiC) MOSFETs significantly improves converter performance by increasing efficiency and reducing costs, to the detriment of electro-magnetic emission and reliability. Implementing a predictive maintenance strategy based on a prognosis tool...
23 02 2026 | Innovation et technologique
Infineon’s CoolSiC MOSFETs have been adopted in the new bZ4X model from Japanese car companyToyota. Integrated into the on-board charger (OBC) and DC/DC converter, the SiC MOSFETs leverage the material’s advantages of low losses, high thermal resistance,...
23 02 2026 | Innovation et technologique
Navitas has announced the launch of its 5th-generation GeneSiC technology platform. The High Voltage (HV) SiC Trench-Assisted Planar (TAP) MOSFET technology is claimed to represent a significant technological leap over previous generations. The technology, which will...
