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This article is part of the Power Management Series: Delving Into Power Density

Members can download this article in PDF format.

What you’ll learn:

  • The benefits of thermal interface materials.
  • Comparing FR-4 laminate with insulated metal substrate (IMS) PCB.
  • How phase-change TIMs may prove to be the best solution.

One of the most important—and difficult—design decisions for circuit designers is creating an optimum heatsink method for high-power devices/systems such as power processors and power supplies. A key area of expertise is the attachment method of an electronic power device to a heatsink or a heat spreader. As power densities increase in power electronics, the thermal interface in between the power module/device and heatsink is now a bigger challenge for designers.

Pour en savoir plus : Thermal Interface Materials: Cool Options for Better Power Density – Electronic Design