This article is part of the Power Management Series: Delving Into Power Density
Members can download this article in PDF format.
What you’ll learn:
- The benefits of thermal interface materials.
- Comparing FR-4 laminate with insulated metal substrate (IMS) PCB.
- How phase-change TIMs may prove to be the best solution.
One of the most important—and difficult—design decisions for circuit designers is creating an optimum heatsink method for high-power devices/systems such as power processors and power supplies. A key area of expertise is the attachment method of an electronic power device to a heatsink or a heat spreader. As power densities increase in power electronics, the thermal interface in between the power module/device and heatsink is now a bigger challenge for designers.
Pour en savoir plus : Thermal Interface Materials: Cool Options for Better Power Density – Electronic Design