As a vital part of electronics, polymer-based thermal management materials effectively accelerate heat dissipation and improve the reliability, stability, and service life of electronics. Herein, a novel strategy of bridge-type 1D SiC nanowires/2D graphite flakes thermal conduction networks with liquid-crystalline orientation is developed to exploit highly thermoconductive aramid/graphite/SiC films (AGSs). The bridge-type 1D/2D liquid-crystalline thermal conduction networks can significantly promote efficient heat transport. The ultrahigh in-plane thermal conductivity of 19.69 ± 0.16 W m−1 K−1 can be achieved in AGSs, about 714 % higher than that of neat aramid. The thermal transport mechanism of composites at the atomic scale was explored based on phonon spectral analysis by molecular dynamics simulation. The developed AGSs can reduce the temperature of the operating phone CPU by about 3.4 °C when used as the heat dissipation material, and the AGSs also can conduct waste heat effectively to generate electric power in a thermoelectric power generation system. This work provides an effective strategy for thermal management and waste heat recovery of electronics by highly thermoconductive nanocomposites with bridge-type 1D/2D liquid-crystalline thermal conduction networks.
Pour en savoir plus : Thermal management and waste heat recovery of electronics enabled by highly thermoconductive aramid composites with bridge-type 1D/2D liquid-crystalline thermal conduction networks