On April 1, 2026, the Federal Communications Commission (FCC) issued a Public Notice seeking comment on how the agency can foster the development and use of domestic drone technologies (also known as unmanned aircraft systems). Entitled “Unleashing American Drone...
The integration of “load bearing – deicing” is of great significance for safe use of carbon fiber composites in ice environment. Here, an investigation on the design, deicing performance and mechanical properties of super hybrid composites composed of stainless...
Pour les onduleurs solaires, les centres de données IA et plus encore… Technologie GaN bidirectionnelle de première mondiale avec blocage DC intégré, réduisant drastiquement le nombre de commutateurs nécessaires dans les topologies de conversion de puissance...
Taiwan Semiconductor has added to its growing series of AEC-Q-qualified 1200V-rated SiC Schottky diodes with 1A and 2A models. Applications benefiting from the reduced size and performance provided by these new, high-voltage, low-current, very fast, low-loss diodes...
In semiconductor manufacturing, numerous key materials and components determine process stability and product yield. While not as widely recognized as wafers or targets, semiconductor graphite fixtures...
InfraTec has developed the E-LIT automation solution specifically for the inspection of electronic and semiconductor modules. Designed as a modular test system, E-LIT uses lock-in thermography to identify and localize thermal anomalies reliably, even in multilayer...
