L’entreprise spatiale Rocket Lab vient d’annoncer une étape importante : le 1 000ème moteur Rutherford est sorti de sa ligne de production. Dans le domaine de la propulsion spatiale, ce chiffre dit quelque chose d’essentiel sur ce à quoi ressemble concrètement la...
Efficient heat dissipation across GaN/SiC interfaces is critical for the reliability of high-power devices, yet their interfacial thermal transport behavior remains insufficiently understood. Here, using a high-fidelity machine-learning interatomic potential, we...
Researchers at Sandia National Laboratories and Auburn University in the US have developed a new method to more accurately detect atomic-scale defects in electronic materials, an advance that could be particularly useful for wide-bandgap (WBG) semiconductors such as...
We propose a new numerical method to estimate the fault tolerance of failure modes in digital circuit structures with a generative network sampling technique. From a random input of generated bitwise configurations of ideally digitalised analog currents in the digital...
Toshiba Electronics Europe has started shipping engineering samples of the TB9M040FTG, a chip that combines a 32-bit microcontroller (MCU) with built-in power MOSFETs for driving small automotive brushless DC (BLDC) motors of under 40W. The device joins Toshiba’s...
A German SME specializes in advanced joining and assembly technologies for high-performance electrical and optical components. Its core expertise lies in flux-free soldering, enabling thermally stable, low-resistance and highly reliable joints for demanding...
