Toshiba Electronics Europe has started shipping engineering samples of the TB9M040FTG, a chip that combines a 32-bit microcontroller (MCU) with built-in power MOSFETs for driving small automotive brushless DC (BLDC) motors of under 40W. The device joins Toshiba’s...
A German SME specializes in advanced joining and assembly technologies for high-performance electrical and optical components. Its core expertise lies in flux-free soldering, enabling thermally stable, low-resistance and highly reliable joints for demanding...
Researchers from the University of Navarra, IKOR Technology Centre, GAIKER Technology Centre, and Valencian International University have published a systematic review examining how additive manufacturing can be used to produce mold inserts for plastic injection...
ROHM a conçu les derniers composants de sa série EcoSiC™ : les MOSFET SiC de 5e génération (présentés au PCIM 2026 à Nuremberg) sont optimisés pour les applications de puissance à haut rendement. Cette technologie convient idéalement aux systèmes de groupes...
Seven new GaN power ICs with 650V rating introduced, targeting emerging applications across Edge AI Computing and E‑Mobility HYDERABAD, India, May 11, 2026 /PRNewswire/ — Cyient Semiconductors Private Limited today announced the launch of seven new gallium...
