11 05 2020 | Innovation et technologie
This work describes the development of a single phase water-cooled microfluidic heat exchanger for cooling very high heat flux electronics. The heat sink was designed for a unique additive manufacturing process capable of manufacturing millimeter-scale metallic parts...
11 05 2020 | Innovation et technologie
A broadband aperture-coupled magneto-electric (ME) dipole antenna array designed for metallic additive manufacturing (AM) is proposed. The proposed array antenna that operates in Ka-band consists of four radiating elements, a power divider and a flange for connecting...
27 04 2020 | Innovation et technologie
Three GaN switches from Power Integrations support 75W power supply adapter designs without a heatsink. Previous devices supported 55W designs.The three InnoSwitch3-MX isolated switcher chips work with the InnoMux controller for higher efficiency 75W power supplies...
20 04 2020 | Innovation et technologie
Transphorm Inc.— the leader in the design and manufacturing of the highest reliability and first JEDEC- and AEC-Q101 qualified high voltage gallium nitride (GaN) power semiconductors — today announced availability of its Gen IV GaN platform. Transphorm’s latest...
13 04 2020 | Actualités NAE - RTI
Chaque semaine NAE vous propose une veille technologique sur une thématique de sa feuille de route technologique. Aujourd’hui retrouvez sa veille sur la thématique Fiabilité électronique qui abordera : Transphorm and Microchip Combine High Reliability GaN and Digital...
